MOP
這個是接觸面養化的現象,根據IPC, the Institute For Interconnecting And Packaging Electronic Circuits,IPC-A-610規範如下:
De-wetting： A condition that results when molten solder coasts a surface and then receded to leave irregularly-shaped mounds of solder that are separated by areas that are covered with a thin film of solder and with the basis metal or surface finish not exposed.
縮錫：經常發上在零件腳或焊墊有局部氧化時，是指焊接完畢的焊點或焊面出現凹陷或高低不平整的表面，或銲錫面支離破碎甚至裸露出底層金屬，或焊點外緣無法正常延展的情況。
以上還有不懂的地方可以提出唷
